METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD
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United States of America Patent
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Issued Date -
May 21, 2009
app pub date -
Nov 13, 2008
filing date -
Nov 16, 2007
priority date (Note) -
Abandoned
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Abstract
An upper mold section and a lower mold section are closed with prescribed mold clamping pressure, for dipping sets of electronic components mounted on a substrate into a resin material melted in cavities. A pressurizing/driving portion pressurizes/drives a pressurizing member toward upper mold section with prescribed pressurizing/driving force, so that this pressurizing/driving force is transmitted to cavity side surface members through a first elastic member and a second elastic member and forward end surfaces of cavity side surface members come into contact with a surface of substrate. The pressurizing/driving force is transmitted to second elastic member, so that this pressurizing/driving force is uniformly transmitted to the respective ones of cavity bottom surface members and resin material heated and melted in respective cavities can be uniformly pressed.
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