FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF
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United States of America Patent
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Issued Date -
May 21, 2009
app pub date -
Nov 15, 2007
filing date -
Nov 15, 2007
priority date (Note) -
Abandoned
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Abstract
The invention relates to a flip chip wafer comprising an active surface having a plurality of bumps (40, 41, 42) formed thereon and having at least one layer of a cured underfill material (30, 35, 36) accommodated between said plurality of bumps (40, 41, 42). The invention further comprises a flip chip die as well as processes for manufacturing a flip chip wafer and a flip chip die.
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