System and method for supplying processing water

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090126543A1
SERIAL NO

12289845

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a system 1A for supplying processing water 3, which is used in the operation of processing a target object with a highly pressurized jet of processing water 3 containing an abrasive, including: a tank 2 for storing the processing water 3, having a lower portion substantially tapering downwards; a supply pipe 5 for supplying the processing water 3 to the tank 2; a delivery pipe 8 having an opening 9 located inside the tank 2; a pressure mechanism 7 located outside the tank 2, for pressurizing the processing water 3; and a suction port 10 provided in the side surface of the delivery pipe 8. The processing water 3 in the tank 2 is stratified into a deposition portion 4A, which is a portion where the abrasive is deposited, and a clear-water portion 4W, which is a portion other than the deposition portion 4A and formed by clear water substantially free from the abrasive. The opening 9 is located near an end of the delivery pipe 8 and at a position within the deposition portion 4A, while the suction port 10 is located at a position within the clear-water portion 4W.

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Patent Owner(s)

Patent OwnerAddress
TOWA CORPORATIONKYOTO JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hibi, Takaaki Kyoto-shi, JP 8 14
Kitagawa, Yasuyuki Kyoto-shi, JP 3 18
Tomizawa, Kana Kyoto-shi, JP 1 3
Yamaji, Shuzo Hirakata-shi, JP 1 3

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