METHOD OF METALLIZING SOLAR CELL CONDUCTORS BY ELECTROPLATING WITH MINIMAL ATTACK ON UNDERLYING MATERIALS OF CONSTRUCTION
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United States of America Patent
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Issued Date -
May 14, 2009
app pub date -
Nov 7, 2008
filing date -
Nov 9, 2007
priority date (Note) -
Abandoned
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Abstract
The invention relates to a metallized solar cell and the method of making thereof that includes depositing a metal or metals such as silver, nickel, copper, tin, indium, gallium, or selenium or their alloys on solar cells in a manner to form more substantial and robust electrical contacts that can carry current more efficiently and effectively or to provide the active layers required to convert sunlight into electricity. These deposits also protect the underlying metallic materials from corrosion, oxidation or other environmental changes that would deleteriously affect the electrical performance of the cell. The invention also relates to the use of specialized electroplating chemistries that minimize residual stress and/or are free of organic sulfonic acids to minimize chemical attack on solar cell substrates or prior metallizations that include organic and/or inorganic binders or related materials for depositing the initial metallic portions of the cell.
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