Stacked package module and method for fabricating the same
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United States of America Patent
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Issued Date -
May 7, 2009
app pub date -
Oct 31, 2008
filing date -
Nov 2, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a stacked package module and a method for fabricating the same. The stacked package module comprises: a first package structure, a second package structure, a ceramic-surfaced aluminum plate, and a metal paste. Herein, the ceramic-surfaced aluminum plate has a plurality of through holes filled with the metal paste to correspond with and electrically connect the first conductive pads of the first package structure and the second conductive pads of the second package structure; and the ceramic-surfaced aluminum plate further has a first cavity to receive a chip. Besides, the present invention provides a stacked package module, which can avoid warpage, omit the process for soldering, favor the shrinkage of size and pitch of the conductive pads, and also can reduce the height of the package.
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