RESIN-SEALED LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
May 7, 2009
app pub date -
Oct 31, 2008
filing date -
Nov 5, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An LED package is formed by separating a sealed body containing a substrate having a plurality of regions into individual bodies. The LED package includes an LED chip mounted on a recessed part in an upper surface of a substrate, a sealing resin to cover an entire surface of the region, a setting pattern provided on a bottom surface of the recessed part to set the LED chip, a wiring pad provided on the bottom surface of the recessed part, a wiring pattern provided on a slanted surface of the recessed part and serving as a light reflection part also, a wire to connect an electrode of the LED chip to the wiring pad, an external terminal provided on a lower surface of the substrate, a connection part to connect the wiring pattern connected to the wiring pad to the external terminal, and a heat radiating pattern provided on a lower surface to radiate a heat generated in the LED chip outside the LED package. The setting pattern is connected to the heat radiating pattern through the connection part.
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