Compounds for Photoresist Stripping
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Sep 29, 2008
filing date -
Oct 31, 2007
priority date (Note) -
Abandoned
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Abstract
A composition for removing undesired matter from a substrate, the composition comprising hydroxylamine or a hydroxylamine derivative, a quaternary ammonium compound and at least one polar organic solvent. The composition is capable of removing photoresist from wafer level packaging and solder bumping applications.
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