Novel Photosensitive Resin Compositions

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United States of America Patent

APP PUB NO 20090111050A1
SERIAL NO

12252203

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This disclosure relates to compositions that include (a) at least one polybenzoxazole precursor polymer; and (b) at least one silicon-containing polymer comprising a moiety of Structure (V):are defined in the specification.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Naiini, Ahmad A East Greenwich, US 36 254
Weber, William East Providence, US 20 516

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