METHOD AND APPARATUS FOR PROVIDING WAFER CENTERING ON A TRACK LITHOGRAPHY TOOL
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 29, 2007
filing date -
Oct 29, 2007
priority date (Note) -
Abandoned
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Abstract
An apparatus for centering a substrate in a track lithography tool includes a processing chamber having an opening large enough to admit the substrate. The processing chamber includes a substrate support member. The substrate is characterized by a diameter and comprises a mounting surface, a process surface, and an edge. The apparatus also includes a clamped robot blade including a substrate support surface adapted to support the mounting surface of the substrate, two edge contact regions, and a base contact region. The clamped robot blade also includes a clamping system adapted to move at least one of the two edge contact regions or the base contact region from an unclamped position to a clamped position, thereby making contact between the edge of the substrate and the two edge contact regions and the base contact region in the clamped position. The apparatus further includes a robot arm coupled to the clamped robot blade.
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