ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD THEREOF
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United States of America Patent
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N/A
Issued Date -
Apr 30, 2009
app pub date -
Oct 28, 2008
filing date -
Oct 31, 2007
priority date (Note) -
Abandoned
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Abstract
An electronic component module, including: a circuit board having: an insulating layer; a plurality of conductive layers formed on respective surfaces of the insulating layer; a ground plane comprising one of the conductive layers and covering the greater part of the surface; and wiring formed on another of the surfaces and comprising the conductive layer; and an electronic component mounted on the circuit board and connected by the wiring, wherein a plurality of slits, formed by removing the conductive layer, are provided in the ground plane.
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