SOLDER AND METHODS OF MAKING SOLDER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090107584A1
SERIAL NO

12240614

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Solder compositions and methods of forming solders are provided. The solder compositions exhibit desirable melting characteristics. In addition, the solder compositions may be useful in joining heat sensitive components such as sensors, system-in-package, memory, and MEMS devices.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
NANODYNAMICS INC901 FUHRMAN BOULEVARD BUFFALO NY 14203

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Revur, Ramachandra R Columbus , US 3 15
SENGUPTA, SUVANKAR Hilliard , US 14 45

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation