METHOD AND SYSTEM FOR CHEMICALLY ENHANCED LASER TRIMMING OF SUBSTRATE EDGES
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United States of America Patent
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Issued Date -
Apr 30, 2009
app pub date -
Oct 30, 2007
filing date -
Oct 30, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled to the housing and proximate to the peripheral portion of the substrate. The fluid dispense nozzle is in fluid communication with a source of a chemical and configured to direct a flow of the chemical to the peripheral portion of the substrate located at a first radial distance from a center of the substrate. The apparatus further includes a light guide optically coupled to a laser source. The light guide is configured to direct radiation to the peripheral portion of the substrate located at a second radial distance from the center of the substrate greater than the first radial distance.
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