Paper Sheet and Paper Sheet Bonding Method

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United States of America Patent

APP PUB NO 20090104397A1
SERIAL NO

11887298

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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[PROBLEMS] To bond a paper sheet containing no thermally fusible component with sufficient strength without forming a through hole, deteriorating texture and increasing the material cost.) thus forming a bonding portion without requiring thermal fusion.

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Patent Owner(s)

Patent OwnerAddress
DAIO PAPER CORPORATION2-60 MISHIMAKAMIYACHO SHIKOKUCHUO-SHI EHIME 7990492

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Muranaka, Toshio Fujinomiya-shi, JP 2 3
Ono, Hiroshi Fujinomiya-shi , JP 377 4339

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