SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATE
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United States of America Patent
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N/A
Issued Date -
Apr 23, 2009
app pub date -
Oct 17, 2007
filing date -
Oct 17, 2007
priority date (Note) -
Abandoned
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Abstract
A solder ball disposing surface structure of a package substrate is disclosed, wherein a package substrate has a chip disposing surface with a first circuit layer, an opposed solder ball disposing surface with a second circuit layer, and a first insulative protection layer formed on the chip disposing surface and the first circuit layer. The solder ball disposing surface structure includes: metal pads integral to the second circuit layer; metal flanges formed around the metal pads; and a second insulative protection layer formed on the solder ball disposing surface, the second insulative protection layer having second openings each with a size smaller than an outer diameter of each of the metal flanges so as to expose a part of surfaces of the metal flanges, thereby increasing contact area of the surface for mounting conductive elements and preventing detachment of the conductive elements from the surface due to poor bonding force.
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