Package on package structure
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United States of America Patent
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Issued Date -
Apr 23, 2009
app pub date -
Oct 15, 2008
filing date -
Oct 17, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a package on package (PoP) structure, which comprises: a first packaging substrate having a plurality of conductive elements on its surface; a second packaging substrate having a plurality of conductive elements on its surface; and a surface-ceramic aluminum plate sandwiched between the first packaging substrate and the second packaging substrate. The surface-ceramic aluminum plate includes plural plated through holes extending through the layer. In addition, the first packaging substrate electrically conducts with the second packaging substrate through these plated through holes. The disclosed structure eliminates the warpage problem of PoP structure, and enhances the strength of PoP structure.
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