HEAT DISSIPATING ASSEMBLY WITH REDUCED THERMAL GRADIENT
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United States of America Patent
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Issued Date -
Apr 23, 2009
app pub date -
Oct 18, 2007
filing date -
Oct 18, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A device to dissipate thermal energy generated by a heat generating component. The device includes a base plate and a housing secured to and disposed on the base plate to form an enclosed space surrounded thereby. The device also includes a plurality of fins secured to the base plate and disposed in the space; an inlet pipe for introducing cooling fluid into the space and an outlet pipe for exhausting the cooling fluid from the space. The inlet pipe has a flow exit positioned over the fins so that the cooling fluid flows from the top portions of the fins toward the base plate.
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