High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin
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Jun 14, 2006
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Jul 1, 2005
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or less. Since recent semiconductor devices are densified and are of large capacity, there is considerable risk of a soft error occurring due to the influence of the α ray from materials in the vicinity of the semiconductor chip. In particular, there are strong demands for purifying the soldering material or tin to be used in the vicinity of semiconductor devices, as well as for materials with fewer α rays. Thus, the present invention aims to provide high purity tin or tin alloy and the manufacturing method of such high purity tin by reducing the α dose of tin so as to be adaptable as the foregoing material.
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