Capacitor-embedded printed wiring board and method of manufacturing the same

United States of America Patent

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Issued Date
Apr 16, 2009
app pub date
Oct 6, 2008
filing date
Oct 10, 2007

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Abstract

having an opening extending through the member and the second electrode to reach the land, the via electrically interconnecting the second electrode and the land in the opening. A method of manufacturing the same is also provided.

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Patent Owner(s)

Patent Owner	Address
NIPPON MEKTRON LTD	1-12-15 SHIBA-DAIMON MINATO-KU TOKYO 105-8585

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Miyamoto, Garo	Ushiku-shi, JP	9	28

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Capacitor-embedded printed wiring board and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

12285447

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SERIAL NO	12285447
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12285447

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