Heat Removal From Electronic Modules
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United States of America Patent
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Issued Date -
Apr 16, 2009
app pub date -
Oct 9, 2008
filing date -
Oct 9, 2007
priority date (Note) -
Abandoned
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Abstract
An electronics assembly for an underwater well installation, comprises a housing; an electrical module located within the housing; and a resiliently deformable member located between the electrical module and the housing for conducting heat between the electrical module and the housing.
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