WIRE BOND LED LIGHTING UNIT
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United States of America Patent
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Issued Date -
Apr 16, 2009
app pub date -
Oct 16, 2007
filing date -
Oct 16, 2007
priority date (Note) -
Abandoned
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Abstract
A wire bond LED lighting unit and method for maximizing heat transfer in an LED lighting unit are disclosed, wherein the LED lighting unit includes an LED package disposed on a first carrier plate and is in thermal communication therewith. A PWB is disposed on the first carrier plate spaced from the LED package. The LED package is in electrical communication with the PWB. The first carrier plate is also in thermal communication with the PWB.
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