Method of Sealing and Molding an Optical Device With Resin
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United States of America Patent
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Issued Date -
Apr 9, 2009
app pub date -
Dec 15, 2006
filing date -
Jan 16, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A top mold capable of holding a substrate and a bottom mold including a cavity having a molding portion corresponding to a geometry of a lens are prepared. Then the substrate with a plurality of chips mounted thereon is fixed to the top mold. Then a translucent resin material is introduced into the cavity and alters to be molten resin. Then the top mold and the bottom mold are closed together to immerse the plurality of chips in the molten resin and also distribute the molten resin in the cavity uniformly. Then the molten resin alters to be a translucent mold product to provide a lens member. Subsequently the top mold and the bottom mold are opened to detach from the bottom mold the substrate bearing the lens member. Then the substrate bearing the lens member is removed from the top mold.
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