SPUTTERING APPARATUS
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United States of America Patent
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Issued Date -
Apr 2, 2009
app pub date -
Sep 4, 2008
filing date -
Oct 2, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sputtering apparatus that shortens the operational down-time that accompanies target replacement is provided. The sputtering apparatus has a deposition chamber in which a sputtering target and a substrate for deposition are disposed, and includes a mobile partition that divides the deposition chamber into two spaces that are sealed off from each other by moving from a retracted position to an operational position, and undoes the dividing of the deposition chamber by moving from the operational position to the retracted position. The operational position is a position between a region in the deposition chamber in which the substrate is arranged and a region in the deposition chamber in which the sputtering target is arranged, and the apparatus is configured such that target replacement can be carried out while maintaining a vacuum state of one of the two spaces that includes the region in which the substrate is arranged.
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