METHODS FOR ATTACHING A FLIP CHIP INTEGRATED CIRCUIT ASSEMBLY TO A SUBSTRATE
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United States of America Patent
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Issued Date -
Mar 26, 2009
app pub date -
Jul 21, 2008
filing date -
Sep 26, 2007
priority date (Note) -
Abandoned
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Abstract
A method for fabricating an integrated circuit assembly, comprises forming a conductive material pattern on a substrate using a process in which the conductive material in wet when formed, the conductive material pattern comprising contact points, before curing the conductive material, placing a integrated circuit comprising contact bumps on the substrate such that the bumps come in contact with the contact points of the conductive material pattern, and allowing the conductive material cure such that the conductive material forms a bond with the bumps.
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