Circuit board structure with capacitor embedded therein and method for fabricating the same
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United States of America Patent
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Issued Date -
Mar 26, 2009
app pub date -
Sep 12, 2008
filing date -
Sep 14, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a circuit board structure with a capacitor embedded therein and the method for fabricating the same. The disclosed structure comprises: a core board; a buffer layer disposed on two surfaces of the core board and having a plurality of open areas; a first circuit layer disposed in the open areas; a high dielectric material film disposed over the first circuit layer and the buffer layer on at least one surface of the core board; and a second circuit layer disposed on the high dielectric material film, wherein the region where the second circuit layer corresponds to the first circuit layer functions as a capacitor, and the first circuit layer on two surfaces of the core board electrically connects to each other by at least one plated through hole. The present invention improves the problem of void generation and enhances the precision of the capacitor region.
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