METHODS FOR PATTERNING ELECTRONIC ELEMENTS AND FABRICATING MOLDS

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United States of America Patent

APP PUB NO 20090074955A1
SERIAL NO

12212330

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for patterning a surface includes providing a first layer of mechanically deformable material having a first surface. A second layer of mechanically deformable material is placed on the first surface. At least a portion of the second layer is controllably displaced to form at least one patterned void through the second layer.

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Patent Owner(s)

Patent OwnerAddress
ENDOTRONIX INC815 OGDEN AVENUE LISLE IL 60532

International Classification(s)

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  • 2008 Application Filing Year
  • B05D Class
  • 2487 Applications Filed
  • 751 Patents Issued To-Date
  • 30.20 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2008200920102011201220132014201520162017201820190255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rowland, Harry D East Peoria, US 19 889

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Patent Citation Ranking

  • 2 Citation Count
  • B05D Class
  • 5.64 % this patent is cited more than
  • 16 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4446615049341374244301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500

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