LED Multidimensional Printed Wiring Board Using Standoff Boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Mar 19, 2009
app pub date -
Sep 7, 2007
filing date -
Sep 7, 2007
priority date (Note) -
Abandoned
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Abstract
A substrate assembly for use in a lamp has a main printed wiring board and a standoff board. The main printed wiring board has a main surface with one or more LED packages disposed on the main surface and electrically connected thereto. The standoff board is disposed on the main surface of the main printed wiring board. The standoff board has an LED package disposed thereon and conductors to provide an electrical connection between the LED package disposed on the standoff board and the main printed wiring board.
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