Multi-Pivot Probe Card For Testing Semiconductor Devices
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United States of America Patent
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app pub date -
Sep 10, 2008
filing date -
Sep 13, 2007
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Abandoned
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Abstract
A novel probe design is presented that comprises a plurality of pivots. These pivots allow the probe to store the displacement energy more efficiently. The novel probe comprises a substrate, and a probe connected to the substrate. The probe further comprises a base that is connected to the substrate, a bending element connected to the base and a probe tip connected to the bending element. In one embodiment, the plurality of pivots may be connected to the substrate such that a portion of the probe may contact the plurality of pivots while the probe tip contacts the device. In another embodiment, the plurality of pivots is connected to the bending element, such that the plurality of pivots may contact the substrate while the probe tip contacts the device. The bending element may also comprise a forked bending element connected to the base, such as the forked bending structure described in co-pending and related patent application Ser. No. 11/855,094. The forked bending structure may include at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure.
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