Circuit board and method for fabricating the same
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United States of America Patent
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Issued Date -
Mar 19, 2009
app pub date -
Sep 19, 2008
filing date -
Sep 19, 2007
priority date (Note) -
Abandoned
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Abstract
A circuit board and a method for fabricating the same are disclosed. The circuit board includes: a carrier board having a circuit layer formed on at least one surface thereof; a first dielectric layer formed on the carrier board and having first openings for exposing a part of the circuit layer; conductive vias formed in the first openings; a second dielectric layer formed on the first dielectric layer and having second and third openings formed therein, wherein the second openings correspond to the first openings for exposing the conductive vias; and a multi-layered metal electroless plating circuit layer formed in the second and third openings for electrically connecting the circuit layer of the carrier board via the conductive vias, thereby allowing the multi-layered metal electroless plating circuit layer to be embedded into the first and second dielectric layers to enhance the bonding strength therebetween and increase the reliability of the circuit board and facilitate formation of fine circuits.
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