Resin Sealing and Molding Apparatus for Electronic Component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Mar 12, 2009
app pub date -
Oct 17, 2006
filing date -
Nov 4, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An apparatus includes a resin supplying mechanism supplying a resin material to a molding assembly. A supplying portion of the resin supplying mechanism is provided with a resin tray. The resin tray includes a tray slit member having a plurality of openings extending in a direction perpendicular to the opening direction of a shutter. The resin material in a required amount is guided into the plurality of openings of the slit member, and thereafter, substantially simultaneously with the shutter being opened, supplied to a cavity space portion.
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