METHOD AND APPARATUS FOR COPPER ELECTROPLATING
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United States of America Patent
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Issued Date -
Mar 12, 2009
app pub date -
Sep 11, 2007
filing date -
Sep 11, 2007
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Abstract
A method and apparatus for a copper electroplating procedure, wherein a first additive is preferentially adsorbed onto the field region of a substrate and a second additive is preferentially adsorbed onto the surfaces of at least one recessed region of the substrate, is provided. The first additive is more resistive to the electrodeposition relative to the second additive such that the recessed regions are filled at a faster rate than a layer is deposited on the field region.
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