Heat sink for an electrical device and method of manufacturing the same
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United States of America Patent
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Issued Date -
Mar 12, 2009
app pub date -
Sep 10, 2007
filing date -
Sep 10, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat sink for an electrical device has a frame and at least one fin. The frame has an inner chamber. The fin is mounted in the inner chamber of the frame to separate the inner chamber of the frame into at least two channels. Therefore, heat generated from any electrical element connected to or mounted on the heat sink will transfer evenly to the heat sink. The heat sink not only dissipates heat evenly, but also provides multiple channels to dissipate heat by convection. Because the heat sink only has one frame, assembly of an electrical device is easy and quick.
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