Endpoint detection system for wafer polishing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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app pub date -
Mar 27, 2007
filing date -
Jun 9, 2000
priority date (Note) -
Abandoned
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Abstract
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
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