Method for Chemical Mechanical Planarization of A Metal-containing Substrate
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United States of America Patent
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Issued Date -
Mar 5, 2009
app pub date -
Aug 21, 2008
filing date -
Aug 30, 2007
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Abandoned
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Abstract
A method using an associated composition for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) is described. This method affords low dishing and local erosion levels on the metal during CMP processing of the metal-containing substrate.
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