Multi-layer adhesive closure
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United States of America Patent
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Issued Date -
Mar 5, 2009
app pub date -
Oct 4, 2007
filing date -
Aug 31, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a multi-layer adhesive closure having a backing and an adhesive layer disposed over the full area beneath the backing, at least the following layers being disposed between backing and adhesive layer: a) a first layer applied not over the full area—marking layer; b) a second layer applied over the full area—contrast layer. It is proposed that an individual identifier be included for verification.
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