Importance

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Abstract

A method for manufacturing a semiconductor arrangement, use of a trench structure, and a semiconductor arrangement is provided that includes a single-crystal semiconductor layer, a conductive substrate region and a buried insulator layer, which isolates the single-crystal semiconductor layer from the conductive substrate region, whereby the conductive substrate region is contacted. A trench structure is formed to separate the single-crystal semiconductor layer into a first semiconductor region outside the trench structure and a second semiconductor region within the trench structure, an opening is formed in the single-crystal semiconductor layer within the second semiconductor region, the buried insulator layer is removed within the opening, and a conductor, which contacts the conductive substrate region and adjoins the second semiconductor region, is introduced into the opening.

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First Claim