ELECTRONIC UNIT AND PRODUCTION METHOD OF THE SAME
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United States of America Patent
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Issued Date -
Mar 5, 2009
app pub date -
Sep 4, 2008
filing date -
Sep 5, 2007
priority date (Note) -
Abandoned
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Abstract
A method of producing an electronic unit in which components are housed in a case and molded with resin, wherein an opening portion of the case housing the components of the unit is closed by a lid plate, the resin is poured into the case through the hole provided in the lid plate to fill the case with the resin while allowing air to be exhausted through a hole provided in a bottom wall portion of the case, with the lid plate of the case directed downward, then the resin in the case is discharged to the outside through the hole provided in the lid plate, and thus a resin mold layer that continuously covers entire surfaces of the components housed in the case and an inner surface of the case is formed with space in contact with the resin mold layer remaining in the case.
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