SUBSTRATE BONDING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Mar 5, 2009
app pub date -
Jun 3, 2008
filing date -
Sep 3, 2007
priority date (Note) -
Abandoned
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Abstract
A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.
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