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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ASM ASSEMBLY AUTOMATION LTD	20/F WATSON CENTRE 16-22 KUNG YIP ST KWAI CHUNG

International Classification(s)

• B05C:APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
• B08B:CLEANING IN GENERAL; PREVENTION OF FOULING IN GENE....

• 2007 Application Filing Year
• B05C Class
• 468 Applications Filed
• 182 Patents Issued To-Date
• 38.89 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
AU, Po Lam Benny	Hong Kong, HK	1	3
# of filed Patents : 1 Total Citations : 3
LAI, Wing Chiu Derek	Hong Kong, HK	3	5
# of filed Patents : 3 Total Citations : 5
LAU, Kei Him Davy	Hong Kong, HK	1	3
# of filed Patents : 1 Total Citations : 3
LAW, Tak Wai Rick	Hong Kong, HK	1	3
# of filed Patents : 1 Total Citations : 3
MASTERS, Jonathan Charles	Hong Kong, HK	8	8
# of filed Patents : 8 Total Citations : 8
YEUNG, Ming Lok Benjamin	Hong Kong, HK	2	4
# of filed Patents : 2 Total Citations : 4

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Patent Citation Ranking

• 3 Citation Count
• B05C Class

• 4.76 % this patent is cited more than
• 16 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2009/0056,761

APPARATUS FOR MAINTAINING A CLEAN BONDING ENVIROMENT

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Abstract

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A bonding apparatus for bonding materials onto a substrate supported on a substrate support is provided with an air generator that is arranged and configured to direct an air flow onto the substrate during bonding. The air generator is located on one side of the substrate support, whereas a suction device is located on an opposite side of the substrate support which is operative to draw the air flow away from the bonding apparatus. The air generator further comprises an air knife that is operative to generate a unidirectional air flow over an entire length of the substrate during bonding.

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Description

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Claims

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