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United States of America Patent

APP PUB NO 20090052152A1
SERIAL NO

12193799

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Abstract

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A high-temperature platform chip has at least three electrodes on an electrically insulating substrate constructed as a heating plate with a heat conductor on the back side.

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Patent Owner(s)

Patent OwnerAddress
HERAEUS SENSOR TECHNOLOGY GMBHHERAEUSSTRASSE 12-14 HANAU 63450

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ULLRICH, Karlheinz Gross-Umstadt, DE 16 108
WIENAND, Karlheinz Aschaffenburg , DE 55 389

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