Surface Acoustic Wave (SAW) Device
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United States of America Patent
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Issued Date -
Feb 26, 2009
app pub date -
Jun 28, 2006
filing date -
Jun 30, 2005
priority date (Note) -
Abandoned
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Abstract
[Problem]In a SAW device using a SH-wave type surface acoustic wave, obtain a means to improve the Q factor.[Means to Solve the Problem]A surface acoustic wave (SAW) device includes a rotated Y-cut quartz crystal substrate where a cut angle “θ” is set in −64.0°<θ<−49.3° with a crystalline Z-axis, an interdigital transducer (IDT) electrode formed on the quartz crystal substrate along a perpendicular direction to a crystalline Z-axis (a Z′-axis direction) of the quartz crystal substrate and grating reflectors disposed at both sides of the IDT, wherein a normalized electrode film thickness “H/λ” which is a film thickness “H” of the IDT electrode normalized by an electrode period “λ” of the IDT electrode is 0.04≦H/λ≦0.12, and a normalized crossing width “W/λ” which is a crossing width “W” of the IDT electrode normalized by the electrode period “λ” is set in the range of 20≦W/λ≦50.
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