CONTACT HEATING ARRANGEMENT
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United States of America Patent
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Issued Date -
Feb 26, 2009
app pub date -
Jan 5, 2005
filing date -
Jan 6, 2004
priority date (Note) -
Abandoned
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Abstract
A heating arrangement for heating one or more liquid-containing microcavities (102) that are present on a microdevice (101) in which there is a contact surface (S.sub.dev) (108). The arrangement comprises a heating support (104,204) that has: a) a support contact surface (S.sub.sup) (110) which is apposed to S.sub.dev (108), when the microdevice (101) is placed on the heating support (104,204), and b) one or more heating elements (120,220) each of which are in thermal contact with S.sub.sup (110), and also with at least one of said microcavities (102), when the microdevice (101) is placed according to (a) with said microcavities (102) matched to said heating elements (120,220),The characteristic feature of the arrangement is that it comprises a sub pressure system (113-119) that is capable of creating sub pressure between said support (104,204) and said microdevice (101) via the support when the microdevice (101) is placed on the support (104,204).
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