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United States of America Patent
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N/A
Issued Date -
Feb 19, 2009
app pub date -
Dec 27, 2006
filing date -
Dec 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
/K, and a copper plate having a thickness of from 0.3 to 1.5 mm is disposed on at lest one face of the backing plate.
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