Liquid cooling module
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United States of America Patent
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N/A
Issued Date -
Feb 19, 2009
app pub date -
Aug 15, 2007
filing date -
Aug 15, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A liquid cooling module has a sealed unit and a heat dissipating module connected by multiple flexible pipes. The sealed unit has a contacting surface attached to an electronic element. The heat dissipating module has a radiator, coolant tanks and a pump all mounted compactly together. The radiator has multiple fins and tubes to allow the coolant to flow through and dissipate heat and may have a fan to increase airflow. The coolant tank is formed on the radiator. The pump circulates the coolant along the coolant pipes. Accordingly, the liquid cooling module has a compact structure and the coolant pipes are flexible, so the liquid cooling module can be mounted simply in a computer case, and is installed easily by home users and professionals alike.
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