Photoresist Composition for Deep UV and Process Thereof

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United States of America Patent

APP PUB NO 20090042148A1
SERIAL NO

11834490

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Abstract

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The present invention refers to a photoresist composition comprising (i) a polymer A comprising at least one acid labile group; (ii) at least one photoacid generator; (iii) at least one base; (iv) a polymer B, where polymer B is non-miscible with polymer A and soluble in the coating solvent, and; (v) a coating solvent composition. The present invention also relates to the process of imaging the photoresist.

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Patent Owner(s)

Patent OwnerAddress
AZ ELECTRONIC MATERIALS USA CORP70 MEISTER AVENUE SOMERVILLE NJ 08876

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chakrapani, Srinivasan Bridgewater, US 22 338
Lin, Guanyang Whitehouse Station, US 30 421
Padmanaban, Munirathna Bridgewater, US 55 936

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