LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Feb 12, 2009
app pub date -
Aug 7, 2008
filing date -
Aug 10, 2007
priority date (Note) -
Abandoned
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Abstract
An LED package is disclosed. The LED package includes a substrate having a plurality of sub patterns adhered by insulation adhesive, an LED chip mounted on the substrate and electrically connected to the substrate and a molding cap covering the LED chip. According to the LED package, as well as simplifying structure, an obstacle is removed at a light course of light emitted from the LED chip, so that light efficiency of the LED chip is improved.
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