WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN
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United States of America Patent
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Issued Date -
Feb 12, 2009
app pub date -
Aug 6, 2008
filing date -
Aug 7, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.
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