HEAT-CONDUCTING MODULE
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United States of America Patent
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Issued Date -
Feb 12, 2009
app pub date -
Aug 7, 2008
filing date -
Aug 10, 2007
priority date (Note) -
Abandoned
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Abstract
In a heat-conducting module and a method for manufacturing the same, the heat-conducting module includes a heat-conducting base and a heat pipe. The surface of the heat-conducting base is formed with a groove. Both sides of the groove protrude upwards to form two side walls respectively. Both of the side walls are provided with hooks respectively that are engaged with each other. The heat pipe is accommodated in the groove of the heat-conducting base and is thus covered and sandwiched by the two side walls. Via this arrangement, the connection between the heat pipe and the heat-conducting base can be firm and steady. In this way, the tight contact between the heat pipe and the heat-conducting base can be increased and the heat-conducting efficiency of the heat-conducting module can be enhanced.
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