FLEXIBLE LAMINATE HAVING THERMOPLASTIC POLYIMIDE LAYER AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

SERIAL NO

12242250

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Abstract

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In a flexible laminate containing a metal foil layer/a thermoplastic polyimide layer or/and a conductor circuit layer/a thermoplastic polyimide layer, the metal foil layer or the conductor circuit layer is bonded to at least one side of the thermoplastic polyimide layer. The thermoplastic polyimide layer is formed from a thermoplastic polyimide resin film or sheet produced by melt extrusion of a thermoplastic polyimide resin. Alternatively, the thermoplastic polyimide layer is formed from a biaxially oriented thermoplastic polyimide resin film or sheet. Such a flexible laminate can be easily manufactured by a lamination method which comprises bonding a thermoplastic polyimide resin film (1) to a metal foil (2) or a conductive circuit layer (4) by heating under pressure, and has excellent heat resistance, electrical properties and mechanical strength inherent in a polyimide. When the biaxially oriented thermoplastic polyimide resin film or sheet is used, the flexible laminate can be improved in dimensional stability and resistance to soldering heat.

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Patent Owner(s)

Patent OwnerAddress
TAIYO INK MFG CO LTDTOKYO TOKYO METROPOLIS
KURASHIKI BOSEKI KABUSHIKI KAISHA7-1 HOMMACHI KURASHIKI-SHI OKAYAMA 710-0054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akane, Noriyuki Neyagawa-shi , JP 2 15
Arima, Masao Hiki-gun , JP 32 248
Ito, Nobuhito Hiki-gun , JP 8 67
Nakano, Masashi Osaka , JP 21 114
NISHIKAWA, Takahiro Neyagawa-shi , JP 48 348
Sasaki, Masaki Hiki-gun , JP 39 206

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