Device and method for scanning the whole surface of a wafer
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United States of America Patent
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Issued Date -
Feb 5, 2009
app pub date -
Jul 25, 2008
filing date -
Aug 3, 2007
priority date (Note) -
Abandoned
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Abstract
A device and a method for scanning the whole surface of a wafer are disclosed. The wafer is deposited on a table movable in the X-coordinate direction and in the Y-coordinate direction. A camera and at least one illumination source are arranged opposite the wafer. The camera is a line camera with a detector row, wherein the length of the detector row is less than the diameter of the wafer.
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