Cr-Cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-release component for semiconductor
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United States of America Patent
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Oct 15, 2013
Grant Date -
Feb 5, 2009
app pub date -
Feb 14, 2007
filing date -
Feb 15, 2006
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Abstract
In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.
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